CORE:T31*19*13C R7K
BASE:FR4 2.0mm THICK
WIRE:AWG(1.15mm) 2UEWH
EPOXY:G500/H210
SOLDER:Sn99.3-0.7-S002
TURNS : 1-4=2-3=20.0TS(Typ)
TEST FREQUENCY : 10KHz/0.1V(TH2776B)
INDUCTANCE : 1-4=2-3=14.25mH±30%
RDC : 1-4=2-3=0.020Ω Max
INSULATION RES : (1-2) 100 MΩ Min@500VDC
HI-POT TEST : (1-2)2500V/DC 1mA/5Sec